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and panel connections in collision repair applications
The MPN for High Teck Products HIT is 77401C-4
quickly and completely removes oily or filmy residues including waxes
Self starting multiple hole sizes
Schlegel Corporation Schlegel 2003 Buffing Pad, 9-1/2 in Dia, Foam Pad, Green 95075 and panel connections in collisionFOAM BUFFING PAD IN GREEN 9" DIAMETER 1 1 2" PILE HEIGHT. APPLICATION LIGHT COMPOUNDING How to Use For light compounding Specifications Technical specifications for Schlegel 2003 Buffing Pad, 9 1 2 in Dia, Foam Pad, Green Part No. 2003 Product Line SCH MFR Model 2003 Application For light compounding Manufacturer Schlegel Corporation Brand Schlegel Overall Diameter (in) 9 1 2 Pad Material Foam Color Green About Schlegel Corporation Schlegel
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